Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled plans to invest $100 billion in the United States over the coming years to expand its semiconductor manufacturing capabilities. The investment will fund the construction of five new facilities, including three chip fabrication plants, two advanced packaging facilities, and a large research and development center.
This announcement was made by TSMC CEO C.C. Wei alongside former U.S. President Donald Trump. TSMC, which is a key client of Dutch chip equipment maker ASML, aims to strengthen its presence in the U.S. semiconductor market. Trump emphasized the importance of producing chips domestically, calling it “a matter of national security.” This latest commitment adds to an investment announced in April of the previous year, where TSMC confirmed plans to open a third factory in Arizona by 2030. While TSMC had already been considering further investments in the U.S., import tariffs played a significant role in accelerating the decision. Exporting chips to the U.S. has become more expensive, making domestic production increasingly attractive.
Although TSMC has not provided an exact timeline for the construction of the new facilities, the company has stated that the project is expected to create approximately 40,000 construction jobs over the next four years. The initiative highlights the company’s commitment to meeting the growing demand for semiconductors while aligning with U.S. efforts to bolster domestic production and reduce reliance on foreign supply chains.